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| Material composition | Structure description | Material specification |
|
| Copper branch | L=42mm | Conductor specification | T=0.07mm |
| L=38.4mm | Insulation film thickness | T=0.05mm(PI film） | |
| Fuse width | 0.14±0.02mm | ||
| Process type | FDC die cut fuse | ||
| Fuse Specification | 5V/10A＜3S | ||
| Packaging method | Carrier packaging+Roll packaging | ||
| Material composition | Structure description | Material specification |
|
| Copper terminal | L=28.36mm L=40.36mm L=52.36mm |
Conductor specification | T=0.07mm |
| Insulation film thickness | 27.5μm(PI film） | ||
| Fuse width | 0.15±0.03mm | ||
| Process type | FDC die cut fuse | ||
| Fuse specification | 5V/10A＜5S | ||
| Packaging method | Roll packaging | ||
| Material composition | Structure description | Material specification |
|
| Copper terminal | L=23.2mm L=57.2mm |
Conductor specification | T=0.07mm |
| Insulation film thickness | 50μm (PI film） | ||
| Fuse width | 0.14±0.02mm | ||
| Process type | FDC die-cutting fuse | ||
| Fuse Specification | 5V/10A＜3S | ||
| Packaging method | Roll packaging | ||
| Material composition | Structure description | Material specification |
|
| Copper terminal | L=40.5mm | Conductor specification | T=0.07mm |
| Insulation film thickness | 27.5μm(PI film） | ||
| Fuse width | 0.14±0.02mm | ||
| Process type | FDC die cut fuse | ||
| Fuse Specification | 5V/10A＜5S | ||
| Packaging method | Carrier packaging+Roll packaging | ||
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